Date:	May 17-20
Place:	Hilton Toronto Airport Hotel, Toronto
	5875 Airport Road Toronto, Ontario Canada

These drive the many challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies. In addition, the European Union’s RoHS directive has now been joined by those of REACH, the dimethyl fumarate ban and the new Canadian Management plan on substances of concern for electrical and electronic equipment complicating matters considerably. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component assembly are among the concerns being addressed. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.

To register for the conference or academy tutorials please click on the "Register Now" button on the right side of the page.

PROGRAM OUTLINE
SMTA Lead-Free Academy
Mon. May 17 - Tues., May 18, 2010
Click on the tutorial titles below to view the full descriptions.

Monday, May 17
T1: True Design for Reliability - Understanding What is and What is not DfR
Craig Hillman, DfR Solutions: 1:30p.m. – 5:00p.m.

T2: Taking Stress Out of Lead Free Assembly by Weeding out PCB Fabrication Defects Before Assembly
Bihari Patel, Research In Motion: 1:30p.m. - 5:00p.m.

Tuesday, May 18
T3: The Reality of Pb-Free Reliability
Craig Hillman, DfR Solutions: 8:30a.m. - 12:00p.m.

T4: Reliability Issues of Lead-Free Solder Joints for Portable Devices
Ning-Cheng Lee, Ph.D., Indium Corporation: 8:30a.m. - 12:00p.m.

Date:	April 20-22
Place:	Shanghai Everbright Convention & Exhibition Center
	88 Caobao Road (West Hall), Shanghai China

The event provides a sourcing platform for new suppliers, gathers new market information and displays the latest technologies to help you enhance your competitiveness in the electronics manufacturing industry

* During the exhibition, NEPCON China brings key electronics industry players together in Shanghai to exchange ideas, establish new contacts and showcase their latest innovations.
* At recent editions of NEPCON China, a selection of world renowned companies such as American Tec, Ascentek, Assembleon, DAGE, First Technology, Fuji, Henkel, Hitachi, Indium, KIC, Mirtec, MYDATA, Nagoya, Nutek, Omron, Panasonic, Saki, Samsung, Senju, Siemens, Smartech, Sun East, Tokyo Juki and WKK China Ltd. have displayed some of the most cutting edge technology on the market today. The show is the ideal place for local industry players to obtain valuable insight into this dynamic industry from international heavyweights and hear about the latest products on the electronics manufacturing market.

Date:	April 06-09
Place:	Mandalay Bay Convention Center
	3950 Las Vegas Blvd. South Las Vegas, Nevada 89119 Las Vegas, USA

Show highlights include:
•FREE! More than 300 exhibitors showing equipment, materials and services. There’s no better place to see and compare.
•FREE! Industry poster sessions and academic posters and competition — Catch up with the latest research and meet the authors and experts.
•Standards development meetings, the best technical conference for our industry in the world, and 39 half-day professional development courses.
•FREE! Innovative Technology Center — see the best of new products judged by an expert committee.