FCT Assembly held a successful Open House at its new facility in Milpitas, Calif. on July 12, 2010. The Open House was well attended with more than 125 guests
The EDA Consortium (EDAC) Market Statistics Service (MSS) today announced that the Electronic Design Automation industry revenue for Q1 2010 was $1247 million, a 4.6 percent increase compared to $1192.1 million in Q1 2009. Sequential EDA revenue declined 1.2 percent, while over the last four quarters it declined 5.9 percent
Jabil Circuit, Inc. today announced that its Board of Directors has approved payment of a quarterly dividend to shareholders of record as of August 16, 2010. The dividend of $0.07 per share is payable on September 1, 2010
Rogers Corporation has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer amplifiers, antennas, and other high-frequency circuits where space is at a premium
Fuwei Films (Holdings) Co. Limited, a manufacturer and distributor of high-quality BOPET plastic films located in China, today announced that its wholly owned subsidiary, Fuwei Films (Shandong) Co. Ltd. has successfully completed the development of a new dry film product. The test sample has passed the strict examination by Hitachi Chemical Shanghai and Asahi ASEI
IPC has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints
Collaborating to offer an unmatched regional event for companies and their employees, IPC — Association Connecting Electronics Industries® and Canon Communications are bringing the best of the global electronics manufacturing industry together at Electronics Midwest, September 28–30, 2010
Camtek Ltd. announced that it would be releasing its financial results for the second quarter of 2010 on Thursday, August 5, 2010. The Company will also host a conference call on the same day, starting at 9:00 am ET
Other News
- Enventure Technology Services Improve Product Assembly Processes
- STMicroelectronics Enables Even More Interactive Portables with New Microphone Interface Chip
- ASSET and IPextreme collaborate to enable ScanWorks as an IEEE 1149.7 test solution
- Milplex Canada Attains UL Thermal Material Certifications
- Mentor Graphics Announces 22nd Annual PCB Technology Leadership Awards Program
- IPC Issues Call for Participation for Electronics Assembly Conference in Budapest
- Adeptron announces partnership with Mexican manufacturing facility that also provides overseas procurement
- Mentor Graphics Signs Exclusive Global Agreement with Automotive Supplier Magneti Marelli
- Aegis Expands the Representative Territory of Rich Sales Inc
- IPC and ESDA Collaborate on Required ESD Training for Electronics Assembly Operators
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IPC Releases PCB Industry Results for July 2010
IPC —Association Connecting Electronics Industries® announced today the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program
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